Equipment

CNC Milling (Datron M7)

Cuts various components of the chip (e.g. channels) into the chosen material.
Precision (mm): <0.01
Minimum tool diameter for glass (mm): 1
Minimum tool diameter for plastic and metal (mm): 0.15


Injection Moulding (Babyplast 610P)

Forms chips by injecting molten material into a pre-formed mould.
Injection volume (cm3): 4 to 15
Minimum distance between platens (cm): 3
Maximum distance between platens (cm): 14
Moulding area (mm): 50 x 50


Hot Press (Collin P200 PM)

Uses elevated heat and pressure along with a stamp to create patterns in chip materials and bond chips
Platen size (mm): 196 x 196
Opening size (mm): 150
Maximum working temperature (°C): 300


Laser Cutter (Laserscript 6840)

Uses high powered lasers to engrave chip features on the surface of materials
Beam diameter (μm): 100
Maximum cutting area (mm): 680 x 400
Location precision (mm): <0.01
Cutting speed (mm/second): 200-400


Plasma Etcher (Henniker HPT-300)

Used along with a substrate to etch microfluidic features on the surface of PDMS chips and for surface treatment of other chips
Tray size (mm): 310 x 190
Power (W): 0-250 (continuously variable output)


Blister Pack Maker (Sephia T501)

Package compounds for on-chip reagent pouches
Operating speed: 300-540 cycles per hour
Maximum format area (mm): 180 x 120


Glass cutter (HT6 BSP)

Cuts glass for use as microfluidic chip materials
Cutting table dimensions (mm): 270 x 127
Maximum travel (mm): 210


Cold Laminator (Jetmounter JM18)

Used in the process of producing paper-based microfluidic devices for use in the field
Maximum laminating width (mm): 464
Laminating speed (millimeters per minute): 0.76-5.5


Wax Printer (Xerox 8580)

Prints paper-based microfluidic devices
Print speed (ppm): 6-51
Paper size (mm): 76 x 127 to 216 x 356


Wafer Dicing Saw (Disco DAD3220)

Precisely cuts thin materials (e.g. silicon wafers) to an appropriate size for microfluidic devices
Maximum workpiece size (mm): 150 x 150
Maximum cutting speed (mm/s): 500


Spin Coater (SCS G3)

Coats chips with reagents to guide the etching process, such as photoresists
Bowl sizes (cm): 29.3, 30.5, 38.1
Rotational speed (RPM): 0-9999
Acceleration/decceleration (seconds): 0.1-25.5


Photolithography equipment (Assorted equipment)

Uses material with photoresist coating exposed to UV light through a photomask to transfer a pattern of exposed material
Etching with hydrofluoric acid takes place to create features in exposed material
Depth of features (μm): <150